If you are faced with the requirement of filling Buried Via Holes in Sequential Build Up Multilayer-Boards, screenprintable PHP-900 Permanent Hole Plugging Ink is the best choice.
By completely filling the holes with this epoxy based thermally curing material it is possible to achieve a planar and voidfree surface onto which a copper deposit or photoimageable Solder Mask can be placed.
Overview
| PHP-900 Type | Hardening conditions | Note |
| DC5-4 | UV + 150°C/30 min. | The product developed in early stages. It is already used for the mass production of CSP, PBGA, FCPKG etc. |
| IR-6 | 80°C/10 min. + 110°C/10 min. + 150°C/30-60 min. | It is already used for the mass production of CSP, PBGA, FCPKG substrate and HDI substrate etc. |
| IR-6P | 140°C/20 min. | Improved productivity. Reduction of hardening time. Better printing situation and improved polishing capability. High peel strength. Low price. |
| IR-10FE | 110°C/60 min. + 150°C/30 min. | High Tg and low CTE product. Excellent printing properties. High reliability against to lead free reflow. |
| IR-15S-3 | 110°C/60min. + 150°C/30 - 60 min. | High Tg and low CTE product. Printing is excellent. |
| NC-735P | 80°C/10 min. + 110°C/30 min. + 150°C/30 min. | Nonconductive paste for BVH plugging. It is already used for the mass production. High peel strength against to T/H replating. |
SRT-60G
Halogen free materials
Hole plugging material of heat hardening type solder resist (non-solvent type).
SRT-60G is the high reliability material newly developed as substitution of the specification of the T/H filling by SR ink of the solvent content type or DFSR fill tent of the which are the conventional method of cut T/H or solder going-up prevention or assembly a preventive measure of the adsorption obstacle etc.
Features
- non-solvent type
- STR-60G reduce generating of a crack as compared with solvent content type SR
- after solvent content type SR processing, selection hole plugging is possible using SRT-60G
If you need further information, please contact us !