Enables production of smooth substrates, same as those produced by additive process.
Undercoating is a new process in which a planar surface PCB is formed by coating the spaces between the signal traces with resin, hardening (B-stage) with ultraviolet light, and then polishing until the traces are exposed. The overall downsizing trend in electronic devices is driving the need to make electronic components, such as PCBs, more compact. The need to regulate thickness for impedance control in laminates, increasing surface mount density, and finer trace patterns are examples of technology advances that should prove this technique to be indispensable for further improvements in PCB reliability and performance.
|
Before undercoating process |
After undercoating process |
|
Model number |
Cure method |
Flexibility |
Note |
|
UC-3000 15 |
Pre-heat + UV + post cure |
no |
Smoothing process by polishing |
|
UC-3000 150 |
Pre-heat + UV + post cure |
no |
Reliability test for DSP, PBGA and FCPKG have been completed. Under mass production for hole plugging process without polishing. Smoothing process without polishing. Smoothing process by polishing. It is applicable to PKG product. It is applicable to general product. |
